Yangzhou Jingcheng Electronics Co., Ltd. is professional in designing, developing, producing, sales and service of RF (Radio Frequency) coaxial connectors.
Modern wireless, radio-frequency, microwave, and high-frequency electronic systems depend on interconnections that are mechanically reliable, electrically stable, and easy to integrate into compact equipment. Although a connector is often a small component, its influence on signal integrity, assembly efficiency, serviceability, and long-term system performance can be significant. A poorly selected connector may introduce impedance discontinuities, excessive insertion loss, unwanted reflection, mechanical stress, or difficult installation conditions. A carefully engineered connector, by contrast, supports predictable RF behavior from the circuit board to the cable, test instrument, antenna, filter, amplifier, or protection device.
The JC3.660.481 SMA-KFD-45 is an SMA micro-strip connector intended for applications requiring a compact coaxial-to-board interconnection. It belongs to the SMA Micro-strip Connectors category and is associated with Yangzhou Jingcheng Electronics Co., Ltd., a Chinese manufacturer specializing in RF coaxial connectors and related products. The company has operated since 1999 and provides a broad portfolio that includes coaxial connectors, adapters, reverse polarity connectors, coaxial lightning protectors, high-frequency cables, cable assemblies, attenuators, terminal loads, antennas, and other RF interconnection products.
This article examines the role of the SMA-KFD-45 in contemporary RF design, the advantages of a carefully manufactured micro-strip connector, the production and quality capabilities supporting the product, and the factors engineers should evaluate before integrating it into a commercial or industrial system. Because the supplied product information does not include a complete mechanical drawing or electrical datasheet, application-specific values such as frequency range, voltage rating, impedance tolerance, plating specification, and mating-cycle rating should be confirmed with the manufacturer before final approval.
JC3.660.481 SMA-KFD-45
Content
An SMA micro-strip connector provides a transition between a coaxial interface and a printed circuit board transmission line. The SMA interface is widely recognized in RF engineering because it offers a compact threaded coupling mechanism, a defined coaxial structure, and broad availability across test equipment, cables, antennas, filters, amplifiers, and communication modules. The micro-strip side of the connector is designed to connect with a board-level RF trace, normally through soldered contacts or another specified board attachment method.
Micro-strip circuits consist of a conductive trace positioned on a dielectric substrate above a reference ground plane. Their impedance is determined by several variables, including trace width, substrate thickness, dielectric constant, conductor thickness, solder mask conditions, and the distance between the signal trace and ground. The connector must therefore provide a transition that controls the electromagnetic field as it moves from the coaxial pin and dielectric structure into the planar transmission line.
When this transition is properly designed, the connector helps reduce reflections and maintain a more consistent impedance through the launch region. When it is poorly matched, even a short transition can produce a measurable return-loss penalty, especially at high frequencies. Mechanical geometry, contact alignment, ground attachment, and the relationship between the connector body and PCB edge all influence performance.
The SMA-KFD-45 is positioned for this type of compact board-level connection. The “45” designation may indicate a 45-degree orientation or a related product geometry, but the exact meaning must be verified against the manufacturer’s drawing. This distinction is important because connector orientation affects cable routing, enclosure layout, board clearance, and the force applied to the PCB during installation.
RF equipment is becoming smaller while operating across increasingly demanding frequency bands. Wireless communication modules, distributed antenna systems, satellite subsystems, industrial sensors, radar assemblies, laboratory instruments, and test fixtures frequently need several RF ports within a limited enclosure. A connector must occupy as little space as practical without compromising the signal path or the mechanical stability of the assembly.
A compact connector can shorten the distance between the circuit and the external interface. This may reduce the need for additional transmission-line routing, cable loops, or bulky mechanical adapters. A suitable board connector can also simplify the grounding structure and make the product easier to assemble. In high-volume equipment, these benefits influence not only electrical performance but also manufacturing time, bill-of-materials cost, inspection requirements, and field service procedures.
The connector’s orientation is another important consideration. A straight connector may be appropriate when the cable exits perpendicular to the board edge, whereas an angled design can support a lower profile or a more convenient cable path. A 45-degree layout may help balance clearance and routing requirements where a full right-angle or straight configuration is unsuitable. It can also reduce sharp cable bends, although the final result depends on the cable type, connector position, enclosure geometry, and minimum bend radius.
Connector selection should always be made as part of the complete RF path. The performance of the SMA-KFD-45 is influenced by the PCB stack-up, the board launch pattern, the mating connector, the cable assembly, the grounding arrangement, and the operating environment. A connector with excellent construction cannot compensate for an unsuitable board footprint or an improperly controlled transmission line.
The JC3.660.481 SMA-KFD-45 is identified as an SMA micro-strip connector. Its intended value lies in providing a compact and practical coaxial transition for board-level RF equipment. It is suitable for design situations where engineers need the familiarity of an SMA interface while connecting directly to a micro-strip circuit rather than using a longer cable or a separate board-mounted coaxial assembly.
The product can be considered for communication hardware, RF modules, signal-conditioning equipment, antenna systems, laboratory instruments, compact test platforms, and other assemblies that use SMA-compatible interfaces. The appropriate application depends on the detailed technical data, including interface gender, mounting method, terminal arrangement, substrate compatibility, electrical rating, and environmental rating.
One of the primary advantages of using a catalogued product such as the SMA-KFD-45 is the reduction in development uncertainty. Engineers can begin with an established connector form instead of creating an entirely new coaxial transition. A standard or semi-standard part can support faster mechanical layout, easier sourcing, more predictable assembly planning, and simpler replacement procedures. If the standard configuration does not exactly match a project requirement, an experienced manufacturer may also be able to provide a customized variation.
At the same time, a product designation alone should not be treated as a complete specification. Procurement and engineering teams should obtain the latest product drawing and technical data before production release. Details that should be confirmed include connector gender, mating interface, body dimensions, board thickness range, recommended PCB footprint, contact material, plating, dielectric material, operating frequency, impedance, voltage rating, temperature range, sealing level, and mechanical endurance.
Most RF systems are designed around a controlled impedance, commonly 50 ohms. The connector transition should preserve this impedance as closely as practical from the coaxial interface into the PCB trace. A carefully engineered central contact, dielectric support, and ground structure can reduce discontinuities at the launch point.
Impedance continuity is important because a mismatch causes part of the incident signal to reflect toward the source. The resulting reflection can reduce transmitted power, create standing-wave behavior, and affect the amplitude and phase response of the system. In narrowband systems, a modest mismatch may be tolerable. In broadband or high-dynamic-range systems, however, connector performance can influence calibration accuracy and overall link margin.
Insertion loss represents the signal power lost as the signal passes through a component. In a short passive connector, conductor loss and dielectric loss may be relatively small, but poor contact quality, surface contamination, inadequate plating, or an abrupt transition can increase loss. A well-manufactured connector supports a repeatable signal path and helps designers keep the total RF loss under control.
Consistency is as important as a favorable nominal value. If individual connectors vary significantly, production units may show different RF behavior even when the same PCB and cable are used. Controlled machining, stable materials, process inspection, and suitable testing help reduce this variation.
Return loss is related to the amount of energy reflected by an RF discontinuity. Better return-loss performance generally indicates a closer impedance match. The connector’s pin position, dielectric geometry, ground interface, and board-launch design all contribute to this result.
Return-loss measurements should be made using an appropriate test fixture and calibration method. The performance of a connector cannot be separated completely from the PCB launch and the mating interface. For this reason, a manufacturer’s data should be reviewed together with the proposed board footprint and assembly method rather than evaluated in isolation.
Compact RF connectors must control unwanted capacitance and inductance around the launch region. Excessive capacitance may be created by a large exposed conductor or an overly close grounded structure, while unwanted inductance may arise from a long signal path, narrow ground connection, or poor current return. A well-designed SMA micro-strip connector minimizes the physical region where the coaxial geometry changes into the planar geometry.
Reducing parasitic effects is particularly valuable in broadband amplifiers, frequency converters, filters, high-speed measurement equipment, and radio modules where small discontinuities can alter gain flatness, phase response, or isolation.
Electrical performance is only one part of connector quality. The connector must also withstand the practical forces generated during assembly, mating, unmating, cable movement, transportation, and service. The SMA interface uses a threaded coupling arrangement, which can provide a secure connection when the mating parts are correctly aligned and tightened according to the applicable procedure.
A board-mounted SMA connector can provide a defined interface at the equipment boundary while keeping the RF path short inside the enclosure. This arrangement may simplify panel design and reduce the number of internal cable assemblies. In applications where every cable introduces an additional connector pair, eliminating unnecessary transitions can improve reliability and reduce potential failure points.
The orientation associated with the SMA-KFD-45 may also support more flexible packaging. An angled connector can permit the mating cable to follow the enclosure contour instead of extending directly away from the board. This may be useful in compact housings, rack-mounted modules, antenna controllers, and equipment with restricted front-panel or side-panel clearance. The actual suitability depends on the approved drawing and the required cable bend radius.
Mechanical strength depends on more than the connector body. The PCB attachment pattern, solder fillets, ground tabs, board thickness, housing support, and cable restraint all affect the finished assembly. If a cable will be frequently connected and disconnected, the enclosure should carry as much of the mating force as possible. The PCB should not be used as the sole structural support unless the design has been validated for that purpose.
The competitive advantages of an SMA micro-strip connector are best understood by comparing it with less integrated or less controlled interconnection approaches.
An improvised cable transition may rely on hand-soldered coax, a loosely supported center conductor, or an unoptimized ground connection. Such solutions can be useful during early prototyping, but they often produce inconsistent geometry and variable RF performance. A purpose-designed connector offers a more repeatable mechanical interface and a more controlled transition into the PCB.
Internal cables provide routing flexibility, but they add cable loss, connector pairs, assembly operations, and potential points of mechanical movement. In a compact module, a board-mounted connector can reduce path length and simplify the internal architecture. It may also free space that would otherwise be reserved for cable routing.
Larger coaxial interfaces may offer higher power handling or greater mechanical robustness, but they can consume valuable panel and board space. SMA connectors are often selected when a compact threaded interface is sufficient for the application. The designer should still verify power, voltage, frequency, and environmental requirements rather than selecting solely by size.
Push-on or snap-on connectors can be convenient where rapid connection is required, but a threaded SMA interface may offer stronger resistance to accidental separation and a more familiar test-equipment ecosystem. This can be valuable in laboratory equipment, field-service modules, and systems exposed to vibration or handling.
Some general-purpose board connectors do not provide the geometry, grounding, or mounting options needed for RF performance. A connector specifically intended for micro-strip use is more likely to address the transition requirements of a controlled-impedance circuit. The final performance still depends on proper board design and assembly, but the starting point is more appropriate.
Yangzhou Jingcheng Electronics Co., Ltd. was founded in 1999 and specializes in the design, development, production, sales, and service of RF coaxial connectors and related products. The company offers more than 2,000 product types, covering standard and specialized interconnection requirements. This breadth is relevant to customers developing RF equipment because a supplier with a broad product family can often support several interfaces within the same project.
The company’s stated capabilities include advanced manufacturing and testing equipment, strong technical resources, rigorous quality systems, and professional research and development and engineering teams. These capabilities support the complete product cycle, from initial design and material selection to machining, plating, assembly, inspection, testing, packaging, and technical service.
A broad product portfolio also creates manufacturing experience across multiple connector structures. Coaxial connectors, adapters, reverse polarity connectors, lightning protectors, attenuators, terminal loads, antennas, cables, and cable assemblies require different combinations of precision parts, dielectric components, contacts, housings, and RF testing. Experience across these categories can help an engineering team identify practical solutions for complex interconnection systems.
For the SMA-KFD-45, manufacturing control is especially important at the central contact and the board interface. Small dimensional changes can influence contact engagement, signal transition, solderability, and impedance. A capable production process should therefore combine suitable material control with precision machining, controlled forming or molding where applicable, surface treatment, assembly fixtures, and inspection procedures.
The exact process for the SMA-KFD-45 should be confirmed with the manufacturer, but a professional RF connector production workflow commonly includes the following stages.
Production begins with a review of the product drawing, interface requirements, board attachment method, material specifications, and customer application. Engineers evaluate the connector’s mechanical envelope, contact geometry, ground structure, and compatibility with the intended PCB. If the product is customized, the customer’s board stack-up, installation constraints, and electrical targets must be reviewed before the design is finalized.
Design verification may include dimensional analysis, tolerance review, three-dimensional modeling, prototype evaluation, and RF simulation or measurement. The objective is to identify potential interference, assembly risks, or electromagnetic discontinuities before large-scale production.
Connector bodies, coupling components, contacts, and mounting elements are commonly produced from carefully selected conductive materials. Precision machining or forming creates the required dimensions and interface features. Critical areas may include the threaded coupling surface, contact retention section, grounding elements, board attachment terminals, and the internal coaxial path.
Dimensional control is essential because the connector must mate with compatible SMA components while maintaining stable electrical geometry. Burrs, deformation, surface damage, or excessive variation can affect both assembly and RF performance. Appropriate gauges and inspection equipment are used to verify critical dimensions.
Surface treatment can improve conductivity, corrosion resistance, wear performance, solderability, and visual consistency. The suitable plating system depends on the component, the electrical requirement, the mating environment, and the customer specification. Contact surfaces generally require particular attention because repeated mating can create wear, contamination, or increased contact resistance if the finish is unsuitable.
Plating thickness, adhesion, coverage, and cleanliness should be controlled through documented procedures and inspection. The final specification should identify the applicable materials and finish rather than relying only on general descriptions such as “gold plated” or “nickel plated.”
The dielectric material supports the central contact and helps maintain the coaxial geometry. Its dimensional stability, dielectric properties, temperature behavior, and resistance to manufacturing stress influence connector performance. Insulating components must be produced and handled carefully to avoid cracks, deformation, contamination, or incorrect placement.
During assembly, the center contact, dielectric support, body, mounting features, and other parts are brought together in a controlled sequence. Fixtures can help maintain alignment and prevent damage to delicate components. Automated or semi-automated procedures may improve repeatability, while trained operators and documented work instructions support flexibility across a broad product range.
The board-side terminals must remain correctly positioned for soldering or other attachment. Misalignment may lead to poor solder joints, insufficient ground continuity, or stress during PCB installation. Assembly inspection should therefore verify both the external appearance and the internal or functional relationship of critical components.
Final inspection may include visual examination, dimensional checks, mating verification, continuity testing, insulation testing, solderability evaluation, and RF performance testing, depending on the product specification. Sampling plans or 100-percent inspection may be applied to different characteristics according to risk and customer requirements.
For demanding RF applications, network-analyzer measurements can be used to assess insertion loss and return loss across the specified frequency range. Mechanical tests may include coupling torque evaluation, retention testing, vibration exposure, temperature cycling, or mating-cycle testing when required. The applicable tests must be selected according to the actual product design and customer use case.
Quality is not created by final inspection alone. It depends on process controls applied throughout incoming material verification, machining, plating, assembly, testing, packaging, and shipment. A rigorous quality system helps define responsibilities, control documents, manage nonconforming products, and support corrective action.
Traceability is particularly valuable for RF components used in regulated, safety-sensitive, or high-reliability equipment. Records may connect a production batch with raw materials, processing conditions, inspection results, test data, and shipment information. This enables faster investigation if a question arises after delivery.
For customers evaluating a supplier, useful quality questions include:
What inspection standards are applied to critical dimensions?
Which electrical characteristics are tested, and over what frequency range?
Are material certificates or plating records available when requested?
How are product revisions controlled?
How are customer-specific drawings and specifications protected?
What procedures are used for handling nonconforming parts?
Can production samples be provided for qualification testing?
The answers help determine whether a supplier can support both prototype development and stable volume production.
Wireless modules often require compact RF ports for antennas, filters, duplexers, power amplifiers, and test access. An SMA micro-strip connector can provide a practical external or internal connection while preserving board space. It may be used in base-station subassemblies, radio units, network equipment, private wireless systems, and laboratory development platforms, subject to electrical and environmental validation.
Antenna assemblies frequently use SMA interfaces because they are readily available and compatible with many cable and measurement products. A board-mounted connector can link the antenna feed to a printed circuit while supporting a compact mechanical layout. Designers must pay close attention to grounding, enclosure effects, and the distance between the connector and the radiating structure.
Laboratory instruments and test fixtures require interfaces that can be connected repeatedly and measured consistently. SMA connectors are common in signal generators, spectrum-analysis accessories, network-analysis fixtures, attenuator panels, calibration tools, and RF evaluation boards. In these applications, connector repeatability, surface cleanliness, and mating practice are important contributors to measurement accuracy.
Industrial sensors, process-monitoring systems, machine-vision equipment, remote monitoring units, and positioning devices may use RF links or high-frequency signal paths. A compact connector can support installation in restricted enclosures while providing a serviceable interface for testing or replacement.
Specialized equipment in aerospace, defense, transportation, and infrastructure may require compact RF interconnections with controlled mechanical and environmental performance. These applications typically impose additional qualification requirements, including vibration, temperature, shock, corrosion, or documentation. The SMA-KFD-45 should be considered only after the manufacturer’s complete environmental and electrical specifications have been reviewed against the project standard.
Even a high-quality connector can perform poorly when installed on an unsuitable PCB. The board footprint should be taken from the current manufacturer drawing, including the signal pad, ground pads, mounting holes, keep-out regions, solder-mask recommendations, and edge-clearance requirements.
The micro-strip trace should be designed for the intended impedance using the actual PCB stack-up. Trace width should not be copied from a different board material or thickness without calculation. The dielectric constant supplied by the PCB manufacturer, copper thickness, solder mask, and reference-plane location all influence the result.
The ground return should be short, wide, and continuous wherever possible. Ground vias may be required around the launch to connect the connector body to the reference plane and reduce unwanted current spreading. However, via placement must follow the recommended footprint because an excessive number of vias or an unsuitable pattern can change local capacitance.
The signal trace should transition smoothly from the connector pad into the micro-strip line. Sudden changes in width, unnecessary stubs, sharp corners, or excessive exposed copper may degrade performance. The board layout should also consider the connector’s mechanical supports and solder fillets.
For multilayer boards, the location of the reference plane is especially important. A connector designed for a top-layer micro-strip launch may not be suitable for a stripline or coplanar-waveguide structure without modification. If the design uses grounded coplanar waveguide, the spacing between the signal trace and adjacent ground features should be evaluated together with the connector geometry.
Before soldering, connector terminals and PCB pads should be clean and free from oxidation, oil, dust, and other contamination. The recommended solder profile should be compatible with the connector materials and the PCB assembly process. Excessive heat or repeated rework can damage dielectric components, alter plating, or weaken the board attachment.
During installation, the connector should be aligned with the PCB footprint without forcing the terminals into position. Mechanical force applied to an improperly aligned part may bend the contact or create stress in the board. After soldering, inspection should confirm complete wetting, acceptable fillet shape, absence of bridges, and secure ground attachment.
SMA mating components should be aligned before threading. The coupling nut should be tightened using the recommended procedure and, where applicable, a calibrated torque tool. The cable should not be rotated by twisting the connector body, and the cable should be supported so that its weight does not load the board-mounted part.
Connector interfaces should be protected with suitable caps when not in use. Dust, moisture, metal particles, and fingerprints can affect high-frequency performance and contact reliability. Cleaning should follow the manufacturer’s instructions and should not introduce abrasive damage or leave chemical residue.
RF equipment manufacturers often require modifications to a standard connector. Possible requirements may include a different mounting arrangement, board thickness range, connector orientation, body material, plating system, cable interface, sealing feature, packaging method, or labeling format. A supplier with engineering and production resources can evaluate whether the requested change can be incorporated without compromising electrical or mechanical performance.
Customization should begin with a clearly defined technical brief. The customer should provide the target frequency range, impedance, power level, voltage, environmental conditions, board thickness, PCB stack-up, enclosure restrictions, mating interface, installation process, expected mating cycles, and applicable compliance requirements.
The manufacturer may then review the design, identify critical characteristics, produce prototypes, and support sample testing. Qualification should include not only connector-level tests but also evaluation in the customer’s actual PCB and enclosure. RF measurements made on a representative assembly are more meaningful than measurements made only on an isolated component.
Yangzhou Jingcheng Electronics Co., Ltd. states that it provides standard, customized, and specialized interconnection solutions. This capability may be valuable for customers who need a connector family rather than a single part. For example, a product development program may require SMA connectors, reverse polarity versions, cable assemblies, lightning protection components, and termination products. Coordinating these items through one experienced RF supplier can simplify technical communication and purchasing.
| Evaluation area | Questions to confirm | Why it matters |
|---|---|---|
| RF interface | Is the mating interface the required SMA configuration and gender? | Prevents incompatibility with cables, panels, instruments, or adapters. |
| Electrical performance | What are the impedance, frequency range, insertion loss, return loss, and power ratings? | Confirms suitability for the complete signal path. |
| Mechanical geometry | What does the “45” configuration represent, and what are the exact dimensions? | Ensures correct enclosure clearance and cable routing. |
| PCB compatibility | What board thickness, footprint, trace structure, and solder process are required? | Reduces assembly problems and launch discontinuities. |
| Materials and finish | Which materials and plating systems are used for the body and contacts? | Influences conductivity, corrosion resistance, wear, and solderability. |
| Environment | What temperature, vibration, humidity, sealing, and corrosion ratings apply? | Determines whether the product can survive the intended operating conditions. |
| Quality documentation | Are inspection records, test reports, certificates, and revision controls available? | Supports qualification, traceability, and regulated production. |
| Supply capability | Can the supplier support prototypes, production quantities, customization, and repeat orders? | Reduces supply risk over the product life cycle. |
RF connector production requires coordinated knowledge of mechanical engineering, materials, plating, assembly, PCB integration, and high-frequency testing. A supplier may produce visually similar parts while delivering different levels of dimensional consistency or electrical repeatability. Experience in RF-specific manufacturing helps a company recognize the relationship between small physical details and system-level performance.
The company’s history since 1999 indicates long-term participation in the connector industry. Its stated portfolio of more than 2,000 product types suggests experience with different interfaces, form factors, and application requirements. This breadth can be useful when a customer’s project develops from a single prototype into a larger interconnection platform.
Technical support is also important during product introduction. Engineers may need guidance on footprint selection, mating components, cable routing, board thickness, test methods, packaging, or alternative configurations. A manufacturer that combines sales, engineering, production, and service resources can often respond more effectively than a supplier focused only on catalogue transactions.
Connector reliability contributes to equipment sustainability because durable interconnections reduce premature repairs, intermittent faults, and unnecessary component replacement. A connector that maintains its mechanical and electrical properties over the expected product life can improve the service life of the entire system.
Lifecycle planning should consider availability, revision control, replacement compatibility, and long-term technical support. Customers should confirm whether the SMA-KFD-45 is a continuing product, whether equivalent variants exist, and how design changes will be communicated. Consistent documentation is especially important when a connector is integrated into a product that will be manufactured for many years.
Material selection and plating should also be reviewed in relation to applicable environmental requirements. Depending on the target market, customers may request declarations concerning restricted substances, conflict minerals, recycling, or other regulatory matters. The relevant compliance documentation should be obtained directly from the supplier.
Consider a compact wireless module with a printed RF circuit, an external SMA cable connection, and limited side-panel space. A straight connector may force the cable to extend into a neighboring assembly. A fully right-angle connector may reduce height but create a sharp routing transition or interfere with the housing. A 45-degree SMA micro-strip configuration may provide a compromise between clearance, cable direction, and PCB access.
In this example, the design team would first confirm the SMA-KFD-45 mechanical drawing and identify the connector’s exact orientation. The PCB engineer would create the recommended footprint and calculate the micro-strip trace for the actual stack-up. Ground vias and mounting pads would be placed according to the design guidance. The mechanical engineer would check cable bend radius, enclosure clearance, tightening access, and structural support.
During validation, the team would measure the complete assembly using a calibrated network analyzer. Measurements could include return loss and insertion loss across the intended frequency band. The assembly would then be exposed to representative temperature, vibration, mating, and cable-handling conditions. If performance remains within the project limits, the connector can proceed through qualification and production release.
This example demonstrates that connector selection is a system decision. The part’s value is realized only when the connector, PCB, cable, enclosure, and assembly process are designed as a coordinated RF structure.
It is an SMA micro-strip connector identified in the supplied product information as JC3.660.481 SMA-KFD-45. It is intended to provide a coaxial SMA interface to a printed circuit board micro-strip transmission line. The exact dimensions, interface gender, mounting details, and electrical ratings should be confirmed using the current manufacturer drawing.
The designation may refer to a 45-degree orientation or another geometry associated with the product series. The supplied information does not define the code, so engineers should request confirmation before completing the mechanical layout.
Main advantages can include a compact form factor, a familiar threaded SMA interface, a direct board-level RF transition, reduced need for internal cable assemblies, practical serviceability, and the potential for controlled impedance when the connector and PCB launch are properly designed.
No. Frequency capability depends on the product design, materials, dimensional tolerances, board launch, mating interface, and test conditions. The manufacturer’s specified frequency range and RF test data should be reviewed before use.
SMA systems are commonly used in 50-ohm RF applications, but the connector’s actual impedance and performance must be confirmed from the technical documentation. The PCB trace and launch must also be designed for 50 ohms where required.
Request the recommended footprint, board thickness range, pad dimensions, mounting-hole requirements, keep-out areas, solder-mask guidance, trace-launch recommendations, and any requirements for ground vias or board edges.
Yangzhou Jingcheng Electronics Co., Ltd. states that it provides standard, customized, and specialized interconnection solutions. Possible customization should be discussed with the engineering team using a complete technical brief and application description.
Potential industries include wireless communication, antennas, RF testing, instrumentation, industrial electronics, sensing, infrastructure, transportation, and specialized aerospace or defense equipment. Suitability depends on the verified product specifications and qualification requirements.
It should be mounted according to the manufacturer’s drawing and recommended PCB assembly process. Correct alignment, soldering temperature, grounding, board support, and post-assembly inspection are important. The PCB should not be subjected to excessive cable or mating forces.
Include the product designation, required quantity, target frequency, impedance, application, PCB thickness, expected operating temperature, mating interface, environmental conditions, required documentation, customization needs, and delivery schedule. Providing this information helps the supplier recommend the correct configuration.
No. An SMA micro-strip connector provides an interconnection interface. A coaxial lightning protector is a separate protective device designed to limit surge energy. The two products may be used in the same RF system, but they perform different functions.
The RF transition includes the connector, solder region, PCB footprint, trace, ground plane, and enclosure. Testing the complete assembly reveals discontinuities and losses that may not be visible in an isolated connector measurement.
The JC3.660.481 SMA-KFD-45 represents a practical approach to compact RF board interconnection. By combining an SMA interface with a micro-strip transition, it can help equipment designers create shorter signal paths, simplify packaging, reduce unnecessary cable assemblies, and maintain a serviceable external RF connection. Its potential advantages over improvised transitions or poorly integrated alternatives include improved repeatability, better mechanical organization, controlled interface geometry, and compatibility with a widely used SMA ecosystem.
The product’s final suitability depends on verified specifications and correct integration. Engineers should confirm the meaning of the product designation, interface configuration, electrical performance, mechanical dimensions, board requirements, materials, plating, environmental ratings, and quality documentation. Proper PCB design, grounding, soldering, cable support, and measurement are essential to achieving reliable results.
Yangzhou Jingcheng Electronics Co., Ltd. brings a long history in RF connector manufacturing, a portfolio of more than 2,000 product types, advanced manufacturing and testing equipment, technical engineering resources, quality systems, and support for standard and customized interconnection solutions. These capabilities can provide value to customers that need not only a single connector but also coordinated RF components, cable assemblies, protection devices, and technical support throughout product development and production.
For new designs, the most effective process is to request the latest drawing and datasheet, compare the connector with the PCB and enclosure requirements, obtain samples, perform RF and mechanical validation, and establish clear production-quality criteria. When these steps are followed, an SMA micro-strip connector can become a reliable part of a compact, high-performance RF architecture.
1. International Electrotechnical Commission. Radio-Frequency Connectors and Coaxial Interconnection Principles.
2. Institute of Electrical and Electronics Engineers. Recommended Practices for Microwave and RF Measurement Techniques.
3. IPC. Standards and Guidelines for Printed Circuit Board Design, Soldering, and Assembly Inspection.
4. Electronic Industries Alliance. Requirements and Test Methods for Coaxial Radio-Frequency Connectors.
5. Yangzhou Jingcheng Electronics Co., Ltd. Product and Corporate Information for RF Coaxial Connectors, SMA Micro-Strip Connectors, Adapters, and Related Components.
6. General engineering references on controlled-impedance micro-strip transmission lines, coaxial-to-board transitions, RF grounding, and connector qualification.
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